芯片衰减片
建议安装方法：
1、 在焊接器件或引线时，最好用控温烙铁，温度保持在260℃。
2、 PCB板上要钻散热孔，并在散热孔中填充焊料。
Suggested mounting procedures:
1.Solder part or leads in place with controlled
temperature iron (260℃).
Drill thermal vias through PCB and f
A： Surface Mount Chip Attenuators
| 额定功率 | 衰减值 | 频率 | 最大驻波 | 尺寸(mm) | 产品型号 | ||||
| Power Rating
(W) |
Attenuation Value | Frequency
(GHz) |
VSWR
(Max) |
Dimensions | Model | ||||
| (dB) | W | L | H | I | B | 点击下方查看规格书 | |||
| 0.5 | 2 | 9 | 1.30 |
0.8
|
1.1 | 0.38 | 0.4 | N/A | RFR2-0.5CA49001A-J |
| 5 | 2 | 9 | 1.30 |
1.27
|
2 | 0.38 | 0.4 | N/A | RFR2-5CA48901A-J |
| 5 | 3 | 9 | 1.30 |
1.27
|
2 | 0.38 | 0.4 |
N/A |
RFR3-5CA48901A-J |
| 20 | 1 | 12 | 1.25 |
2.5
|
2.5 | 0.25 | 1.1 | N/A | RFR1-20CA48301A-J |
| 15 | 2 | 3 | 1.20 |
4
|
4 | 0.6 | 1 |
N/A |
RFR2-15CA9301C-J |
| 15 | 2 | 2 | 1.20 |
6
|
3 | 1 | 0.5 |
N/A |
RFR2-15CA66801A-J |
| 30 | 3 | 6.5 | 1.30 |
6
|
6 | 1 | 1 |
N/A |
RFR3-30CA1108B-J |
| 建议安装方法 | 1、 在焊接器件或引线时，最好用控温烙铁，温度保持在260℃。 2、 PCB板上要钻散热孔，并在散热孔中填充焊料。 Suggested mounting procedures: 1.Solder part or leads in place with controlled temperature iron (260℃). Drill thermal vias through PCB and f |
|---|
